CRYOCHIPS — Wafer-Scale Quantum Refrigeration CRYOCHIPS
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QUANTUM COOLING OF HOT CHIPS: ANANT

Wafer-Scale Refrigeration for AI Compute Engines

CRYOCHIPS pioneers wafer-scale quantum refrigeration technologies, unlocking unprecedented potential of quantum computing and AI computing engines. ANANT chips provide reliable, scalable thermal management of high-density compute systems. ANANT chips remove the memory wall by cooling HBMs to lower operating temperatures, and providing high-COP solid-state microchillers for compute trays within racks.

Wafer-Scale Refrigeration for AI Compute Engines
THE ARCHITECTURAL SHIFT

Cooling, Engineered at the Junction Level

ANANT is built on patented quantum cold point coolers. Energy-selective cold point barriers filter hot electrons to optimize semiconductors to attain high thermoelectric figure-of-merit zT. ANANT implements efficient multistage solid-state coolers that operate over a wide range of temperatures: 400K → 300K → 200K → 100K → 40K

< 200μm

Wafer Thickness

150 - 300mm

Semiconductor Wafer Manufacturing Scale

High COPs

Polymer-Free

Made in the USA
CRYOCHIPS
ANANT-Cooled High Bandwidth Memories

Cool 85°C Operation of HBMs in Proximity of Hot 100+°C GPUs

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Efficient Active Cooling

ANANT keeps HBMs within "safe" range for maximum bandwidth avoiding throttling for intensive compute WITHOUT increase in net module power dissipation

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Reduced Error Rates

Every 10°C reduction in operating temperature reduces error rates in high-throughput access by 50%. ANANT-cooled HBMs eliminate error-correction induced bandwidth reductions

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Reduction in Refresh Rates

ANANT-cooled HBMs result in exponential lowering in access transistor leakage currents and 10× reduction in refresh rates, improving bandwidth utilization

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High-Bandwidth PHY Circuits

Reduced jitter and delays in synchronization results in enhanced bandwidths of PHY circuits

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Significant Reliability Improvements

HBM4+ operation at 85°C decelerates Arrhenius mechanisms and results in 4-5-fold improvement in lifetimes